Customization: | Available |
---|---|
Customized: | Customized |
Structure: | Desktop |
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Input Power | 220VAC 50/60Hz, single phase 2000W (including pump) |
Source Power | Two sputtering power sources are integrated into one control box DC source: 500W for coating metallic materials RF source: 600W with automatching for coating non-metallic materials ( Center) Compact 300 RF source is available at extra cost |
Magnetron Sputtering Head | Two 2" Magnetron Sputtering Heads with water cooling jackets are included One is connected to RF power supply for no-conductive materials Another is connected to DC sputtering power source for coating metallic materials Target size requirement: 2" diameter Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets One stainless steel and one Al2O3 ceramic targets are included for demo testing Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads Customized coater: Two DC head without, RF sputtering, RF head without DC sputtering, 3 RF head are available upon request |
Vacuum Chamber |
Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel Observation Window: 100 mm diameter Hinged type cover on top with air spring sport makes target exchange easy |
Sample Holder | Sample holder size: 140mm dia. for. 4" wafer max (also can be designed as your requirement) Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C |
Gas Flow Control |
Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in Flow rate: 200 ml/min max. Flow rate is adjustable on the 6" touch screen control panel |
Vacuum Pump Station |
High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed Mobile pump station is included and the compact sputtering coater can be put on top of station Max. vacuum level: 10^-6 torr with chamber baking |
Thickness Monitor |
One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å LED Display Unit outside chamber can:5 pcs quartz sensors (consumable) are included Input material to be coated according to data base included Display total thickness coated and coating speed Water cooling is required |
Overall Dimensions |
L1300mm× W660mm× H1200mm |
Net Weight | 160 kg |
Warranty | One years limited warranty with lifetime support |
Application Note | In order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O |