1" Magnetron Sputtering Source with Flexible Head for DIY RF & DC Sputtering Coater

• Customization: Available
• Customized: Customized
• Structure: Desktop
• Model NO.: CY-HVMSS-SPC-1-LD
• Material: Aluminum
• Certification: CE, TUV
• Application: School, Hospital, Lab
• Type: Magnetron Sputtering Source
• Sputtering Head Diameter: 1.82"
• Maximum Target Thickness: 3mm
• Target Diameter: 25.4mm
• Cathode Sputtering Voltage: 200-1000V
• Cathode Sputtering Current: 3AMP
• Transport Package: Wooden Box
• Specification: 1"
• Trademark: CY
• Origin: Zhengzhou, China
• HS Code: 85141090
• Production Capacity: 210 Sets Per Month

Product Description

1" Magnetron Sputtering Source with Flexible Head for DIY RF & DC Sputtering Coater - HVMSS-SPC-1-LD
The HVMSS-SPC-1-LD is a magnetron sputtering gun with a flexible head capable of accommodating a wide range of 1" Dia. sputtering sources. Its compatibility with DC, pulsed DC and RF power supplies ensures maximum versatility and extends its usage to various sputtering targets (e.g. metallic, electrically insulating, magnetic or non-magnetic, and etc). Furthermore, its high vacuum design makes the use of Argon under low-pressure levels improves the quality of coating through reducing gas collisions inside the chamber.  
 

Features	High field strength and uniform field profile achieved via use of electromagnetic finite element calculations in the design of the permanent magnetic assembly Low impedance sputtering head and standard RF connector easily match and interface with a wide range of DC and RF sputtering power supplies. . Easy installation with common tools. Magnets are isolated from cooling water with the protective coating against corrosion to maximize durability. Sputtering source is bakeable up to 200°C 1" Copper Backing Plate  (EQ-CBP-1) is included. Standard ¾" OD Shaft Accepts 1/8" (3 mm) thick targets; 1 piece of copper target is included as standard accessory
Sputtering Gun	Sputtering Head Diameter:         1.82" (46.3mm) Target Diameter: 1.0 ± 0.02" (25.4mm) Maximum Target Thickness:       1/8" (3mm)  Magnets: NdFeB Rare Earth Magnet Shaft Diameter: 3/4" O.D.
Electrical Connector	Standard HN Female Connector is included (DC and RF, Picture below left ) Optional SL16 cable Connector   148 cm RF cable is recommended with extra cost
Power Requirement	DC (Max.) 250 W RF (Max.)100 W
Cathode Sputtering Current	3 Amp (Max.)
Cathode Sputtering Voltage	200 - 1,000 V
Operating Pressure Range	~1 mTorr to 1 Torr
Sputtering Thickness Uniformity Curve	NOTE: The Normalized Film Thickness graph above was obtained from depositing a ~200-nm thick film with a PVD HV Magnetron sputtering gun using a 1-inch Cu target. Measurements were performed using a 4-point probe in two mutually perpendicular directions (X, Y) across the wafer surface. The film was deposited onto an oxidized non-rotating Si wafer under the following conditions: 150 Watts DC in 10 mTorr (Ar) Distance of 3-inches (75-mm) from target to substrate
Water Cooling (Required)	Flow Rate requirement:               1/2 GPM, filtered Water Inlet Temperature:             <20 C Water hook up:                       0.25" O.D. quick disconnects
Electrical & Mounting Fittings	Electrical Connector: Standard HN type (DC and RF)
Tilt Assembly	The sputtering head can be tilted +/- 45 degrees for adjusting the incidence angle of bombardments to improve the sputtering yield. Scribe lines on the tilt assembly offer precise angle adjustments.
Warranty	One year limited with lifetime support