Precision CNC Specimen Cutting Machine with Accessories

• Customization: Available
• Type: Angle Grinder, Surface Grinding Machine
• Power Source: Electricity
• Model NO.: CY-SYJ-400
• Object: Turning Tool
• Application: Construction
• Disc(Wheel) Type: Sanding Discs
• Material: Metal
• Working Style: High-speed universal
• Disc Diameter: 150mm
• Variable Speed: With Variable Speed
• Processing Object: Gear
• Abrasives: Abrasive Belt
• Controlling Mode: CNC
• Automatic Grade: Automatic
• Cylindrical Grinder Type: Universal Cylindrical Grinder
• Precision: Precision
• Certification: CE, TUV
• Condition: New
• Accuracy: 0.0025mm
• X-Axis: 1-50mm/Min
• Y-Axis: 1-50mm/Min
• Z-Axis: 1-20mm/Min
• Name: Specimen Cutting Machine
• Warranty: One Year
• Transport Package: Wooden Box
• Specification: dia. 100mm
• Trademark: CY
• Origin: Zhengzhou, China
• HS Code: 8464101000
• Production Capacity: 310 Sets Per Month

Product Description

Introduction of specimen cutting machine
SYJ-400 is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Microelectronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components. The EC-400 saw can
be computerized with position accuracy of 0.01 mm. The sample stage with two angles adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable are installed.

Technical parameter of specimen cutting machine
 

Voltage	AC 110V or AC 220V +/- 10%
Motor	Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm.  Power consumption: 180W
Effective Cutting Range	3 dimension:   X-axis: 8"      Y-axis:4"        Z-axis:4"
Moving/Cutting Speed Range	X-axis: 1-50mm/min adjustable Y-axis: 1-50mm/min adjustable Z-axis: 1-20mm/min adjustable
Accuracy	0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades Kits	One 4" Dia x, 0.35 mm thick fully sintered diamond blade   Two pairs of flanges with 62 mm Dia. ( for dicing ) and 42 mm Dia. (for deep cutting)
PC Software	Laptop and PC software are provided with the equipment.  Cutting parameters can be set in software as cutting length, width, diameter, time, feed speed, kerf loss, etc Manual or programmable control mode
Water Cooling	Assemblies of water jetting, draining, and Transparent plastic splashing protection is included.
Accessories	Complete accessories are included for immediate use, including 120L/min Oilless vacuum pump,  4" diamond blade and sample holder.etc. One vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).are included for dicing the thin wafer
Optionals	For longer wire life, please use LubeCool -150 Smart Solid Lubricant and Coolant For better lighting, please consider a Fiber Optic Y-shape Dual Light Microscope Illuminator In order to ensure accurate alignment when cutting the wafer, you should choose 25x stereo microscope with support frame  For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider using 100 microns ultra-thin diamond blade because of fewer kerfs.
Net WT& DIMEN	Net Weight: 33.5 kg  580 L x 560 W x 660 H (mm)
Shipping WT & DIMEN	Shipping weight: 170 lbs  48"L x 40"W x 37"H (inch)
Warranty & Compliance	One year limited with lifetime support

More photos of specimen cutting machine