magnetron sputtering with ion cleaning process DC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater
Brief introduction of the magnetron sputtering system:
CY-MSP-RFDC is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE etc. at low cost.
Product Description
Brief introduction of the magnetron sputtering system:
CY-MSP-RFDC is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE etc. at low cost.
Detailed Photos
Specification of the DC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater system
Compact Structure |
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Input Power |
- 220VAC 50/60Hz, single phase
- 2000W (including pump)
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Source Power |
Two sputtering power sources are integrated into one control box
- DC source: 500W for coating metallic materials
- RF source: 600W with automatching for coating non-metallic materials ( Center)
- Compact 300 RF source is available at extra cost
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Magnetron Sputtering Head |
- Two 2" Magnetron Sputtering Heads with water cooling jackets are included
- One is connected to RF power supply for no-conductive materials
- Another is connected to DC sputtering power source for coating metallic materials
- Target size requirement: 2" diameter
- Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets
- One stainless steel and one Al2O3 ceramic targets are included for demo testing
- Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads
- Customized coater: Two DC head without, RF sputtering, RF head without DC sputering, 3 RF head are available upon request
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Vacuum Chamber |
- Vacuum Chamber: 300 mm Dia x 400 mm height, made of stainless steel
- Observation Window: 100 mm diameter
- Hinged type cover on top with air spring sport makes target exchange easy
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Sample Holder |
- Sample holder size: 140mm dia. for. 4" wafer max
- Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
- The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C
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Gas Flow Control |
- Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in
- Flow rate: 200 ml/min max.
- Flow rate is adjustable on the 6" touch screen control panel
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Vacuum Pump Station |
- High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level
- Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed
- Mobile pump station is included and the compact sputtering coater can be put on top of station
- Max. vacuum level: 10^-6 torr with chamber baking
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Thickness Monitor |
- One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å
- LED Display Unit outside chamber can:5 pcs quartz sensors (consumable) are included
- Input material to be coated according to data base included
- Display total thickness coated and coating speed
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- Water cooling is required
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Overall Dimensions |
L1300mm× W660mm× H1200mm |
Net Weight |
460 kg |
Warranty |
One years limited warranty with lifetime support |
Application Note |
- In order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm
- Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O
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Product Parameters
Display of the DC/RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater system
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