| Customization: | Available |
|---|---|
| Type: | Angle Grinder, Surface Grinding Machine |
| Power Source: | Electricity |
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| Features | Precision Polishing Jig for accurate wafer / substrate polishing and back-thinning Thickness control screw fixture with resolution of 0.005 mm to limit stock remove This Polishing fixture can be fit with Unipol 1202 and 1502 and any precision 12" or larger polishing machine with York support to achieve automatic polishing or lapping. Maximum sample thickness: 13mm Maximum travel distance: 14mm |
| Sample Holder Vacuum chuck | Maximum size of wafer or substrate is 4" If thickness of sample is greater than 0.15 mm, adopt vacuum absorption. If thickness is less than 0.15 mm, use wax. |
| Digital Micrometer | One digital micrometer is included with resolution of +/- 1 micron for more accurate lapping. |
| Pressure Indicator | One digital pressure indicator is included with range from 1g to 5000g. |
| Vacuum Absorption and Filter | Require a vacuum pump with rate > 70 L/ min. To protect the vacuum pump from any moisture and liquid, connect the filter between fixture and pump. |
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