• 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
  • 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
  • 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
  • 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
  • 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
  • 12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)

12" Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)

Type: Angle Grinder, Tool Grinding Machine
Power Source: Electricity
Object: Turning Tool
Application: Construction
Disc(Wheel) Type: Sanding Discs
Material: Metal
Customization:
Diamond Member Since 2016

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Basic Info.

Model NO.
CY-Unipol-1202
Working Style
High-speed universal
Disc Diameter
150mm
Variable Speed
With Variable Speed, 0-80rpm
Processing Object
Gear
Abrasives
Grinding Wheel
Controlling Mode
Artificial
Automatic Grade
Manual
Cylindrical Grinder Type
Universal Cylindrical Grinder
Precision
High Precision
Certification
CE, TUV
Condition
New
Power
400W
Timer
0-99 Hours
Rotating Shaft
< 5micron
Warranty
One Year
Transport Package
Wooden Box
Specification
12 inch
Trademark
CY
Origin
Zhengzhou, China
HS Code
85141090
Production Capacity
230 Sets Per Month

Product Description

12" Precision Auto Lapping/Polishing Machine with Two 4" Work Stations - EQ-Unipol-1202
Introduction

UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.
 Specification
Power AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.
Features One cast iron plate for lapping and one cast aluminum plate for polishing.
Two rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4" wafers at the same time.
Complete accessories are included for immediate use
Super-Flat 12" (300 mm) Diameter Lapping Plate Flatness < 0.25 micron / inch²
Precision Rotating Shaft Running Off < 5 micron
Heavy Duty Cast Aluminum Case with Bright Painting Color : Black or White
Two Work Stations with 8° Rocking and adjustable speed 8" rocking with 0- 9 rocking / minute adjustable
Two Flat Sample Holders for Carrying < 4" Dia. Wafer 105 Dia. x 35 T mm
Two Condition Rings 120 O.D. x 110 I.D. x 32 T mm
Variable Speed of Master Plate with Digital Display 0 ~ 150 rpm
Adjustable Timer for Auto-Stop 0 - 99 hours
Motor 300 W high torque DC motor
Dimensions 700 L x 475 W x 300 H (mm)
Weight 154 lbs 
Dimensions of shipment 40"x30"x26"
Weight of shipment 220 Lbs

Optional Parts
SKZD-2 Automatic Slurry Feeder 
2" Polishing Fixture for Precision / Automatic Thinning and Polishing
Compliance CE Certified
 
 
Standard package
 
No. Description Qty
1 12" polyimide foam pad 1 pc
2 12" poromeric pad 1 pc
3 Power cord 1 pc
4 Sample holder 2 pcs
5 Wax 2 pcs
6 Condition ring 2pcs
7 Hex wrench & screwdriver 1 set
8 Fuse(10A) 2 pcs
9 12" iron plate 1 pc
10 12" Aluminum plate 1 pc
11 Input tube & output tube 1 pair
 
 12&quot; Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
12&quot; Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
12&quot; Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)
12&quot; Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)

Zhengzhou CY Scientific Instrument Co., Ltd is mainly engaged in the research and development, design, manufacturing and sales of equipment used in scientific researches. Independence and innovation is the company's tenet.Our main products include: tube furnace, muffle furnace, plasma cleaner, vacuum furnace, atmosphere furnace,CVD system and customized
lab equipment
.Welcome you come to visit us. 


12&quot; Precision Auto Semiconductor Automatic Polishing Machine (Unipol-1202)

 

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