Coating Equipment Magnetron Sputtering Coater with Two Guns for Wafers

• Type: Coating Equipment
• Coating: Vacuum Coating
• Substrate: Steel
• Certification: CE
• Condition: New
• Magnetron Sputtering Head: 2" Diameter
• Model NO.: CY-600-2HD
• DC Source: 500W
• RF Source: 500W
• Transport Package: Plastic Paper Inside, Polyfoam Filled, Wooden Box
• Specification: Vacuum Chamber: 300 mm Dia x 300 mm height
• Trademark: CY
• Origin: Henan
• HS Code: 8486202200
• Production Capacity: 100/Month

Product Description

Vacuum Coating Equipment Magnetron Sputtering Coater with Two Guns for Wafers

CY-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc..

Technical Parameter

Input Power	1.220VAC 50/60Hz, single phase  2.2000W  (including pump)
Source Power	1.Two sputtering power sources are integrated into one control box
	2. DC source: 500W for coating metallic materials
	3.RF source: 500W with automatching for coating non-metallic materials
	4.Compact 300 RF source is available at extra cost
Magnetron  Sputtering   Head	1.Two 2" Magnetron Sputtering  Heads with water cooling jackets are included     One is connected to RF power supply for no-conductive materials     Another is connected to DC sputtering power source for coating metallic materials
	2.Target size requirement: 2" diameter
	3.Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets
	4.One stainless steel and one Al2O3 ceramic targets are included for demo testing
	5. Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled  recirculating water chiller is included for cooling both magnetron sputtering heads
	6. Customized coater: Two DC head without RF sputtering,  RF head without DC  Sputering, 3 heads (3 DC/ 2DC+1RF/ 3RF) are available upon request.
Vacuum  Chamber	1.Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
	2.Observation Window:  100 mm diameter
Sample Holder	1.Sample holder size: 140mm dia. for. 4" wafer max
	2.Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
	3.The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C
Gas Flow  Control	1.Flow rate:  200 ml/min max.
	2.Flow rate is adjustable on the 6" touch screen control panel
Vacuum Pump  Station	High speed turbo vacuum pump system is directly installed on the vacuum chamber   for max. vacuum level
	Heavy duty dual stage mechanical pump is connected to turbo pump for faster  pump speed
	Mobile pump station is included and the compact sputtering coater can be put on  top of station
	Max. vacuum level: 10^-6 torr with chamber baking
Thickness  Monitor	One Precision quartz thickness sensor is built into the chamber to monitor coating    thickness with accuracy 0.10 Å
	LED Display Unit outside chamber can:
	Input material to be coated according to data base included
	Display total thickness coated and coating speed
	5 pcs quartz sensors (consumable) are included
	Water cooling is required
Water Chiller	One digital temperature controlled recirculating water chiller is included.  Refrigeration range: 5~35 °C Flow rate: 16 L/min Pump pressure: 14 psi
Overall  Dimensions	L6600mm× W660mm× H1200mm
Net Weight	160 kg
Warranty	One years limited warranty with lifetime support