• Laboratory Small Scale Diamond Wire Cutting Machine/Lab Compact Mini Precision Wire Saw
  • Laboratory Small Scale Diamond Wire Cutting Machine/Lab Compact Mini Precision Wire Saw
  • Laboratory Small Scale Diamond Wire Cutting Machine/Lab Compact Mini Precision Wire Saw

Laboratory Small Scale Diamond Wire Cutting Machine/Lab Compact Mini Precision Wire Saw

Max Diameter of Workpiece: <500mm
Display: Digital
Weight: 100-500Kg
Power Source: AC220V
Transport Package: Ply Wooden Carton
Specification: 734mm x540mm x475mm
Customization:

Contact Supplier

Diamond Member Since 2016

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
CY-DWC300-A
Trademark
CYKY
Origin
Zhengzhou, China
Production Capacity
5000pieces/Month

Product Description

 

The automatic diamond wire cutting machine is suitable for cutting materials with different hardness, such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials. It is mainly used for processing large-sized precious materials, and the cutting size can reach 24".

CY-DWC300-A automatic diamond wire cutting machine is especially suitable for cutting large-size samples. It can also be used for cutting seed crystals of artificial crystal materials such as silicon, white sapphire, and sapphire, as well as square cutting of silicon crystals and sapphire crystals. When used in the slicing of precious gemstones and biological plasticized specimens, not only the slits are small, but the quality of the cut pieces is excellent, which greatly improves the utilization rate of materials.

The CY-DWC300-A automatic diamond wire cutting machine is a continuous cutting diamond wire cutting machine. After the cutting program is set, the sample is continuously fed without manual adjustment. The size of the sample after cutting has high accuracy, within the range of ±10μm.

The cutting wire of CY-DWC300-A automatic diamond wire cutting machine adopts a single wire reciprocating movement mode, the length of the usable wire is long (≤270m), the service life of the wire is long, and the cutting efficiency is greatly improved.The tensioning wheel adopts pneumatic tensioning mode, and the air pressure can be adjusted according to the thickness of the wire diameter. When the wire diameter used is too small, it can also effectively protect the cutting wire without breaking due to excessive tension. This machine is especially suitable for the cutting of large samples, especially the cutting of samples over 12".

Technical parameters of diamond wire cutting machine:

Name

Automatic diamond wire cutting machine

Model

CY-DWC300-A

Features

1. The cutting size can reach 12". (max)

2. The main motor drives the diamond cutting line to move downward at a constant speed, and the material is fixed on the worktable to ensure stable cutting.

3. The worktable can be adjusted by 360° rotation manually or through program control.

4. The pneumatic tensioning system is adopted and imported pneumatic components are used to make the tensioning force more stable and reliable.

5. PLC program control system and large-size touch screen make the operation simple and quick.

6. Various tooling fixtures can be designed according to your needs.

Functions

1. Ceramic materials: alumina ceramics, zinc oxide ceramics, zirconia ceramics, target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, non-conductive ceramics, etc;

2. Crystal material: graphite, silicon crystal (solar polysilicon, monocrystalline silicon), sapphire, alumina crystal, infrared glass crystal, alumina crystal, silicon carbide crystal, cesium iodide crystal, etc.;

3. Glass materials: chalcogenide glass, optical glass, quartz glass, infrared glass, glass tube, etc.;

4. Metal materials: iron, aluminum, copper, titanium alloy, magnesium alloy and other metals and alloys, non-ferrous metals (zinc sulfide, ferrite), etc.;

5. Composite materials: PVC board, carbon fiber composite material, glass fiber composite material, etc.

6. Rock materials: precise sections of natural rocks, jade, meteorite, Peicui, agate and other high-value materials; geological optical slices, geological thin sections (sedimentary rocks, magmatic rocks, metamorphic rocks, ores), etc..

7. Thermoelectric materials: bismuth telluride, lead telluride, silicon germanium alloy, etc.

8. Infrared optical materials: zinc selenide, zinc sulfide, silicon, germanium and other crystals

9. Biomedical materials:Bioplasticization specimen sections (human animal organs, jaw joint sections of soft and hard tissues, implant observation, tooth crown and   bridge, teeth and other histological specimens);

Combined sections of soft and hard tissues in orthopedics department (fresh tissues and hard tissues such as   femur, hip joint and vertebral body, bone histological samples with implants, etc.);

Cardiac and cerebrovascular stent section, stone section and other medical tissue sections;

Parameters

1. Power supply: 220 V 50 Hz;

2. Power: < 550W (max);

3. Spindle motor: AC frequency conversion motor, Power 400W;

4. Y, Z, R axis motor: precision stepping motor;

5. Cutting wire speed: 0-8m / s adjustable, digital display;

6. Total length of cutting line: ≤ 150m;

7. Cutting line diameter: ≤ 0.45mm;

8. Y axis travel: ≤ 300 mm, digital display;

9. Z axis travel: ≤ 300 mm, digital display;

10. Y, Z axis feed indication accuracy: 0.01mm;

11. Worktable angle: 0-360°, resolution 0.01°, digital display;

12. Repeated positioning accuracy of worktable: < 0.032°

13. Cutting sample size: Ø 300 mm × 300 mm (max);

14. Tension system: pneumatic tension, tension pressure adjustment range 0-1mpa;

15. Safety control device: self stop and emergency stop switch of line break

Specifications

Size: 1000mm×900mm×1700mm

Weight

About 500kg

Contact Information:
 
Laboratory Small Scale Diamond Wire Cutting Machine/Lab Compact Mini Precision Wire Saw



 

Send your message to this supplier

*From:
*To:
avatar Mr. Wang
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now